Part Number:AMC1200
Hello,
I am building a digital current sensing solution, for which i am using AMC1200 for amplification of low voltages of kelvin shunt resistor and reading them via MSP430FR5994 differential ADC. Below is my current schematic around AMC1200.
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Please note that, all components of this schematic are surface mount, soldered on breakout board. Since rest of my design is through hole, i have converted this design to through hole with the use of DIP breakout board.
I have few questions regarding this design.
1. Is it safe to use the breakout board approach? Will it affect the accuracy or performance of AMC1200? I am placing capacitors and resistors as close to AMC1200 as possible.
2. Since operation of system is purely DC, i plan to use 15Ohm and 10uF input RC filter, so that i get approx 1KHz cutoff frequency. ( fc = 1/(2*pi*R*C) ). Are my calculations correct for filtering AC noise?
3. I have not used RC filter on output side. But datasheet example designs (page # 15,16) have output RC filters also.
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Is it necessary to use output RC filter? My microcontroller is less than 80 mm far from AMC1200 breakout board. If yes, then what values of output filter, and how close to microcontroller?
4. I had bought this AMC1200 from mouser.com, and its casing had some info written over it, such as number of hours before which IC should be soldered after opening the case. And some information related to humidity restrictions also. I have opened the case around 4 months back. Does that render my IC useless, as the case mentioned soldering IC within a week. ?
5. I am using same +5V source for high side and low side (converted to +3.3V via AMS1117) supplies, and GND1, GND2 are also taken from same ground plane. Is it okay to do that? I don't need isolation as my load (high power LEDs) and other circuit probably won't generate fluctuations.
Thank you for your time and help in answering my questions.
Regards,
Hard Patel