I would like to use LM2903ITLX/NOPB in environment with high temperature exposure ~100+ C degree. The package size YZR is important, cannot be replaced by bigger part on existing design. The temperature range for this part is -40 to +85 C degree by the data sheet. In our application the maximum output (sink) current is no more than 700uA ... so, the power dissipation should be low. Are there other strict limitation on this part which avoid to use it in mentioned environment of high temperature? (The silicon based product are able to withstand higher temperature, I assume, the named limitation is for maximum current rating only, not for the chip or package (?) … Thank you, Peter
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