Part Number:OPA2333
Hi team,
my customer has a question when using OPA2333. We have an exposed pad in the middle of the device and as the datasheet says, it's for "thermal and electrical characteristics". And we need to connect the pad to VS- as well as the thermal pad in PCB. I can understand that the it will improve thermal dissipation, but how to understand that this will benefit for electrial and mechanical and improve reliability? Can you explain in more details?
Thanks !