Part Number: LMH6702QML-SP
Other Parts Discussed in Thread: LM7171, LM6172
Other Parts Discussed in Thread: LM7171, LM6172
Tool/software:
Hello! : )
I'm using your radiation tolerant LMH6702QML, LM6172QMGWRLQV andLM7171AMGFQMLV in a design. All these use the NAC packages.
The package drawings for these parts are:
https://www.ti.com/lit/ml/mclg025b/mclg025b.pdf NAC 16pin
https://www.ti.com/lit/ml/mclg025b/mclg025b.pdf NAC 10 pin
I'd like to know if there is any metallization on the packages (either on the underside or top side)
Ultimately I'd like to know if its safe to have exposed copper (vias / pads for the commercial part etc) underneath or a conducting heatsink touching the parts.
Appreciate the help!
Adam